Molybdenum Flat Sputtering Target


Molybdenum Flat Sputtering Target

Purity: 99.95%  Density: ≥10.2g/cm³  Unit weight: ≤200kg/Pc

Size Range: Customizable to meet customer specifications

Standard: ASTM-B-387 or ASTM-B-386, Type 360, Type 361, Type 363, Type 364, or Type 365.

Chemical element

Mo Other Each
≥99.95% ≤0.05% ≤0.001%

Molybdenum Sputtering Target

Purity: 99.95%

Density: ≥10.2g/cm³

Size Range: Customizable to meet customer specifications

Appearance: The molybdenum target exhibits a uniform metallic luster on both its inner and outer surfaces, without any signs of oxidation, hydrogenation discoloration, scratches, deformation, or burrs when examined under a microscope.

Uses: The molybdenum target is widely employed in various industries for the production of heat-generating parts and heat-insulating components for vacuum blast furnaces. It is also utilized in the chemical industry to manufacture digesters, heaters, coolers, and other equipment. Furthermore, the molybdenum target finds applications in sectors such as aviation, aerospace, and medical equipment.

The molybdenum target is specifically designed for magnetron sputtering coating, which is an advanced physical vapor deposition (PVD) method.

During magnetron sputtering coating, an orthogonal magnetic field and an electric field are established between the cathode (the molybdenum target) and the anode. The vacuum chamber is filled with an inert gas, typically argon (Ar). The electric field causes the ionization of Ar gas into positive ions and electrons. By applying a negative high voltage to the molybdenum target, the emitted electrons experience enhanced ionization due to the magnetic field. As a result, a high-density plasma is formed near the cathode, facilitating the acceleration of Ar ions towards the target surface through the Lorentz force. The high-speed bombardment of the target surface by the Ar ions leads to the ejection of molybdenum atoms from the target, following the principle of momentum conversion. These atoms then deposit onto the substrate, forming a film with considerable kinetic energy.

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